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March 18, 2026

PRINTED ELECTRONICS NEWS

Imec Launches University Consortium Around Next-Gen Chips

CMOS 2.0 will provide advanced, versatile 3D stacked platforms that push the boundaries of compute performance.
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Today's Breaking News

Flexible Electronics News

Schreiner ProTech on Display at LogiMAT 2026

Billed as an event driven by a “Passion for Details,” LogiMAT 2026 demonstrates what effects can have in logistics and manufacturing.

Flexible Electronics News

SEMI Announces 205 European Award Winners

SEMI Europe recognizes Tyndall and Imec for their contributions to the semiconductor industry.

Flexible Electronics News

Identiv Reports Q4 & Fiscal 2025 Financial Results

Q4 net revenue exceeds guidance, driven by growth with key customers and operational excellence.

Flexible Electronics News

Flex Announces U.S. Manufacturing Collaboration with AMD

The collaboration extends U.S.-based manufacturing, starting with AMD Instinct MI355X GPU platforms, and scaling to future generations.

Flexible Electronics News

SEMI Presents Todd Young with Government Leadership Award

SEMI Americas President Joe Stockunas gave the award to Senator Young at the U.S. Capitol during the SEMI Washington Fly-In.